Transaction card having an electrically applied coating

ABSTRACT

A transaction card may comprise a first card component having an electrically conductive surface configured to receive an electrically applied coating. An electrically applied coating may be formed on the electrically conductive surface. The transaction card may be manufactured by forming a first card component having an electrically conductive surface configured to receive an electrically applied coating. The method may also include applying an electrically applied coating to the electrically conductive surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationSer. No. 62/428,455 filed Nov. 30, 2016, and is a continuation of U.S.Non-Provisional patent application Ser. No. 15/713,222 filed Sep. 22,2017, the contents of which are hereby incorporated in their entirety.

TECHNICAL FIELD

The disclosed embodiments generally relate to a transaction card, andparticularly, to a transaction card having an electrically appliedcoating.

BACKGROUND

This application claims priority to U.S. Provisional Patent ApplicationSer. No. 62/428,455 filed Nov. 30, 2016, and is a continuation of U.S.Non-Provisional patent application Ser. No. 15/713,222 filed Sep. 22,2017, the contents of which are hereby incorporated in their entirety.

Transaction cards, such as credit and debit cards, have increasinglybecome a primary means for customers to engage in financialtransactions. Typically, transaction cards are formed of plasticmaterial. For example, a typical credit card may be manufactured out ofPVC plastic using extrusion molding and lamination processes. Theplastic card may then be modified to add functional and/or visualfeatures. For example, a magnetic strip may be affixed to one side, thecard may be stamped with the card number and customer name, and color ora design may be added for appearance.

Typical materials used to manufacture transaction cards (e.g., PVCplastic) may result in cards that are not very durable, are prone toscratching, wearing, and layer separation, and lack visual and/ortactile appeal. Typical transaction cards may also be limited in termsof how they are constructed, their achievable mechanical properties, andtheir ability to achieve stylistic variability. For instance,transaction cards of varying weight, color, texture, style, shape,thickness, flexibility, rigidity, density, and other physical propertiesmay be desired, but traditional transaction cards may be limited in howvariations of these features can be achieved. Therefore, an improvedtransaction card that enables the use of various construction designs,manufacturing processes, and materials is highly desirable.

The present disclosure addresses one or more of the problems set forthabove and/or other problems associated with conventional transactioncard constructions.

SUMMARY

The disclosed embodiments relate to a transaction card having anelectrically conductive surface configured to receive an electricallyapplied coating.

A transaction card may comprise a first card component having anelectrically conductive surface configured to receive an electricallyapplied coating. An electrically applied coating may be formed on theelectrically conductive surface.

In another aspect, the first component of the transaction card may havean electrically conductive material applied to a substrate. Theelectrically conductive material applied may be a metal plating, anelectrically conductive foil, a printed conductive ink, or anelectrically conductive ink. The electrically applied coating formed onthe electrically conductive surface may be an electrostatically appliedcoating, an electrophoretic deposition coating, an electroplatedcoating, an anodized coating, or a powder coated layer. The transactioncard may further include a coating layer disposed on the electricallyapplied coating. The coating layer may be a non-opaque electricallyapplied material.

In another aspect, the substrate can be an electrically conductivesubstrate material or an electrically non-conductive material. Thesubstrate can be metal or plastic.

In some aspects, the electrically conductive surface of the first cardcomponent may define a first outer surface of the transaction card. Thetransaction card can also include a second card component separate fromthe first card component. The second card component may define a secondouter surface of the transaction card. The first and second cardcomponents may comprise the same material or may comprise differentmaterials.

The transaction card may include, in some aspects, a data storagecomponent. The data storage component may comprise an EMV chip or amagnetic strip. The transaction card can further include an aperture.The aperture can be configured to enable communication between the datastorage component and an associated device. The magnetic strip may bejoined to the second card component. The second card component may beconfigured to enable the data storage component to communicate with anassociated device external to the transaction card.

In another aspect, the transaction card can include a first cardcomponent that is configured to be joined to the second card component.The first card component may have a first electrically conductivesurface and the second card component may have a second electricallyconductive surface. In some aspects, the first card component maycomprise metal and the second card component may comprise plastic. Inother aspects, the first card component may be formed of a firstmaterial and the second card component may be formed of a secondmaterial that is different from the first material. The first materialmay be electrically conductive while the second material may beelectrically non-conductive. The second material may comprise plastic,wood, fabric, rubber, or ceramic.

The transaction card may further include a lip section formed on aportion of the first card component. The transaction card may furtherinclude a second lip section formed on a portion of the second cardcomponent. The transaction card may further include an adhesive layerbetween the first card component and the second card component.

In other aspects, the transaction card can further include a firstelectrically applied coating formed on the first electrically conductivesurface, and a second electrically applied coating formed on the secondelectrically conductive surface. The first electrically applied coatingmay have a first electrically conductive material while the secondelectrically applied coating may have a second electrically conductivematerial that is different from the first electrically conductivematerial.

Consistent with another embodiment, a transaction card is provided. Thetransaction card may include a first card component defining a firstside of the transaction card and a second card component joined to thefirst card component and defining a second side of the transaction card.The first card component may further include an electrically conductivesurface configured to receive an electrically applied coating. Theelectrically applied coating may be formed on the electricallyconductive surface of the first card component. The transaction card canfurther include a data storage component. In some aspects, at least oneof the first or second card components is configured to enablecommunication between the data storage component and another device.

In another aspect, the first and second card components may beconfigured to at least partially define an interior cavity of thetransaction card. The data storage component may be disposed at leastpartially within the interior cavity.

Consistent with another embodiment, a method of manufacturing atransaction card is provided. The method may include forming a firstcard component having an electrically conductive surface. Theelectrically conductive surface may be configured to receive anelectrically applied coating. The method may further include applying anelectrically applied coating to the electrically conductive surface.

In another aspect, the method may include forming the first cardcomponent by applying an electrically conductive material to asubstrate. Applying the electrically conductive material to thesubstrate may be applying a metal plating to the substrate, applying anelectrically conductive foil to the substrate, applying a printedconductive ink to the substrate, or applying an electrically conductivepaint to the substrate. Applying the electrically applied coating maycomprise applying an electrostatically applied coating, applying anelectrophoretic deposition coating, applying an electroplated coating,applying an anodized coating, or applying a powder coated layer. Themethod may further include providing a coating layer on the electricallyapplied coating. Providing the coating layer on the electrically appliedcoating may comprise applying a non-opaque electrically applied materialon the electrically applied coating.

In another aspect, the substrate can be an electrically conductivesubstrate material or an electrically non-conductive material. Thesubstrate can be metal or plastic.

In some aspects, the electrically conductive surface of the first cardcomponent may define a first outer surface of the transaction card. Thetransaction card can also include a second card component separate fromthe first card component. The second card component may define a secondouter surface of the transaction card. The first and second cardcomponents may comprise the same material or may comprise differentmaterials.

The transaction card may include, in some aspects, a data storagecomponent. The data storage component may comprise an EMV chip or amagnetic strip. The transaction card can further include an aperture.The aperture can be configured to enable communication between the datastorage component and an associated device. The data storage componentmay further include a magnetic strip joined to the second cardcomponent. The second card component may be configured to enable thedata storage component to communicate with an associated device externalto the transaction card.

In another aspect, the method can further include joining a first cardcomponent to the second card component together. The first cardcomponent may have a first electrically conductive surface and thesecond card component may have a second electrically conductive surface.In some aspects, the first card component may comprise metal and thesecond card component may comprise plastic. In other aspects, the firstcard component may be formed of a first material and the second cardcomponent may be formed of a second material that is different from thefirst material. The first material may be electrically conductive whilethe second material may be electrically non-conductive. The secondmaterial may comprise plastic, wood, fabric, rubber, or ceramic.

The method may further include forming a lip section on a portion of thefirst card component. The method may further include forming a secondlip section on a portion of the second card component. The method mayfurther include forming an adhesive layer between the first cardcomponent and the second card component.

In other aspects, the method can further include forming a firstelectrically applied coating on the first electrically conductivesurface, and forming a second electrically applied coating on the secondelectrically conductive surface. The first electrically applied coatingmay have a first electrically conductive material while the secondelectrically applied coating may have a second electrically conductivematerial that is different from the first electrically conductivematerial.

Consistent with another embodiment, a method of manufacturing atransaction card is provided. The method may include forming a firstcard component defining a first side of the transaction card and asecond card component joined to the first card component and defining asecond side of the transaction card. The first card component mayfurther include an electrically conductive surface configured to receivean electrically applied coating. The electrically applied coating may beformed on the electrically conductive surface of the first cardcomponent. The method can further include providing a data storagecomponent. In some aspects, at least one of the first or second cardcomponents is configured to enable communication between the datastorage component and another device.

In another aspect, the first and second card components may beconfigured to at least partially define an interior cavity of thetransaction card. The data storage component may be disposed at leastpartially within the interior cavity.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosed embodiments, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate disclosed embodiments and,together with the description, serve to explain the disclosedembodiments. In the drawings:

FIG. 1 is a schematic illustration of an exemplary transaction system,consistent with disclosed embodiments;

FIG. 2A is a front view illustration of an exemplary transaction card,consistent with disclosed embodiments;

FIG. 2B is a rear view illustration of the transaction card of FIG. 2A;

FIG. 2C is a side view illustration of the transaction card of FIGS. 2Aand 2B;

FIG. 3 is a front view illustration of an exemplary transaction card,consistent with disclosed embodiments;

FIG. 4A is a cross-sectional view illustration along line 4-4 of FIG. 3;

FIG. 4B is another cross-sectional view illustration along line 4-4 ofFIG. 3;

FIG. 5 is a front view illustration of an exemplary transaction card,consistent with disclosed embodiments;

FIG. 6A is a cross-sectional view illustration along line 6-6 of FIG. 5;

FIG. 6B is another cross-sectional view illustration along line 6-6 ofFIG. 5;

FIG. 7 is an exploded-view illustration of an exemplary transactioncard, consistent with disclosed embodiments;

FIG. 8 is a front view illustration of the transaction card of FIG. 7;

FIG. 9A is a cross-sectional view illustration along line 9-9 of FIG. 8;

FIG. 9B is another cross-sectional view illustration along line 9-9 ofFIG. 8;

FIG. 9C is another cross-sectional view illustration along line 9-9 ofFIG. 8;

FIG. 10 is a front view illustration of an exemplary transaction card,consistent with disclosed embodiments;

FIG. 11A is a cross-sectional view illustration along line 11-11 of FIG.10;

FIG. 11B is another cross-sectional view illustration along line 11-11of FIG. 10; and

11C is another cross-sectional view illustration along line 11-11 ofFIG. 10.

DETAILED DESCRIPTION

Reference will now be made in detail to the disclosed embodiments,examples of which are illustrated in the accompanying drawings. Whereverconvenient, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

The term “transaction card,” as used herein, may refer to any physicalcard, card-like product, or similar article that is configured to store,transmit, and/or receive information, such as financial information(e.g., card numbers, account numbers, etc.), quasi-financial information(e.g., rewards balance, discount information, etc.) and/orindividual-identifying information (e.g., name, address, etc.). Examplesof transaction cards include credit cards, debit cards, gift cards,rewards cards, frequent flyer cards, merchant-specific cards, discountcards, identification cards, and driver's licenses, but are not limitedthereto.

The physical properties of the transaction card (e.g., size,flexibility, location of various components included in the card) maymeet the various international standards, including, for example,ISO/IEC 7810, ISO/IEC 7811, ISO/IEC 7812, ISO/IEC 7813, ISO/IEC 7816,ISO 8583, ISO/IEC 4909, and ISO/IEC 14443. For example, a transactioncard may have a dimension of 85.60 mm (length) by 53.98 mm (width) by0.76 mm (thickness), as specified in ISO/IEC 7810.

FIG. 1 illustrates an exemplary transaction system 10. Transactionsystem 10 may be a computing system configured to receive and sendinformation between the components of transaction system 10 and withcomponents outside of system 10. Transaction system 10 may include afinancial service provider system 12 and a merchant system 14 connectedby a network 16. It should be understood, however, that transactionsystem 10 may include additional and/or alternative components.

Financial service provider system 12 may be one or more computer systemsassociated with an entity that provides financial services. For example,the entity may be a bank, credit union, credit card issuer, or othertype of financial service entity that generates, provides, manages,and/or maintains financial service accounts for one or more customers.Financial service accounts may include, for example, credit cardaccounts, checking accounts, savings accounts, loan accounts, rewardaccounts, and any other types of financial service account. Financialservice accounts may be associated with physical financial servicetransaction cards, such as a credit or debit cards that a user may carryon their person and use to perform financial service transactions, suchas purchasing goods and/or services at a point of sale (POS) terminal.Financial service accounts may also be associated with electronicfinancial products and services, such as a digital wallet or similaraccount that may be used to perform electronic transactions, such aspurchasing goods and/or services online.

Merchant system 14 may be one or more computer systems associated with amerchant. For example, merchant system 14 may be associated with anentity that provides goods and/or services (e.g., a retail store). Themerchant may include brick-and-mortar location(s) that a customer mayphysically visit and purchase goods and services. Such physicallocations may include computing devices (e.g., merchant system 14) thatperform financial service transactions with customers (e.g., POSterminal(s), kiosks, etc.). Additionally or alternatively, merchantsystem 14 may be associated with a merchant who provides electronicshopping mechanisms, such as a website or a similar online location thatconsumers may access using a computer through browser software, a mobileapplication, or similar software. Merchant system 14 may include aclient device, such as a laptop computer, desktop computer, smart phone,or tablet, that a customer may operate to access the electronic shoppingmechanism.

Network 16 may be any type of network that facilitates communicationsand data transfer between components of transaction system 10, such as,for example, financial service provider system 12 and merchant system14. Network 16 may include but is not limited to a Local Area Network(LAN), a Wide Area Network (WAN), such as the Internet, and may be asingle network or a combination of networks. Network 16 is not limitedto the above examples and transaction system 10 may implement any typeof network that allows the entities (shown and not shown) of transactionsystem 10 to exchange data and information.

Transaction system 10 may be configured to conduct a transactionassociated with the use of a transaction card 20. In one example,financial service provider system 12 may provide transaction card 20 toa customer for use in conducting transactions associated with afinancial service account held by the customer. In an example of onesuch transaction, the customer may use transaction card 20 at a merchantlocation to make a purchase. During the course of the purchase,information may be transferred from transaction card 20 to merchantsystem 14 (e.g., a point of sale device). Merchant system 14 maycommunicate with financial service provider system 12 via network 16 tocomplete the transaction. For example, merchant system 14 may receiveaccount information from transaction card 20. Merchant system 14 maytransmit the account information and a purchase amount, among othertransaction information, to financial service provider system 12.Financial service provider system 12 may settle the transaction bytransferring funds from the customer's financial service account to afinancial service account associated with the merchant.

For example, in some embodiments, transaction card 20 may include datastorage component(s) 24 disposed in a card frame 22. As used herein,“data storage component(s)” may be or include one or more devicesconfigured to receive, store, process, provide, transfer, send, delete,and/or generate data or other information. For example, data storagecomponent(s) 24 may include a microchip (e.g., EMV chip), acommunication device (e.g., Near Field Communication (NFC) antenna,radiofrequency identification (RFID) device, Bluetooth® device, WiFidevice), a magnetic strip, a barcode, a Quick Response (QR) code, and/orother devices. Data storage component(s) 24 may be configured to storeinformation in a computer-readable format. For example, data storagecomponent(s) 24 may be configured to store information in a format thatcan be read by merchant system 14, transmitted over network 16, and reador processed by financial service provider system 12 (referring to FIG.1).

While transaction system 10 and transaction card 20 are depicted anddescribed in relation to transactions that involve customers, merchants,and financial service providers, it should be understood that theseentities are used only as an example to illustrate one environment inwhich transaction card 20 may be used. It should be understood thattransaction card 20 is not limited to financial products and may be anyphysical card product that is configured to receive, store, and/ortransmit information. For example, transaction card 20 may be anidentification card configured to provide information for identifyingthe holder of the card (e.g., driver's license).

FIGS. 2A-2C show front-, rear-, and edge-view illustrations,respectively, of an exemplary embodiment of transaction card 20. Thefront-view illustration of FIG. 2A shows a first side 26 (e.g., a frontside) of card 20, and the rear-view illustration of FIG. 2B shows asecond side 28 (e.g., a rear side) of card 20 opposite the first side26. That is, first side 26 may face a first direction outward from acenter of card 20, and second side 28 may face a second directionoutward from the center of card 10 such that the second direction isgenerally opposite the first direction. For example, card 10 may have athree-dimensional structure with a first dimension D₁ (e.g., a width), asecond dimension D₂ (e.g., a length), and a third dimension D₃ (e.g., athickness), wherein the first side 26 and second side 28 of card 10 areseparated by at least one of D₁, D₂, and D₃. As shown in FIG. 2C, firstand second sides 26 and 28 of card 20 are separated by D₃, (e.g., athickness of card 20). It is noted that card 20 is not limited torectangular shapes and designs, and that dimensions D₁, D₂, and D₃ mayvary with respect to one another such that card 20 may resemble adifferent shape.

As shown in FIG. 2A, first side 26 of card 20 may include visibleinformation 30. Visible information 30 may include, for example,personal information, such as information that is associated with acard, a user of the card, or information relating to an accountassociated with the card or card user. In some embodiments, visibleinformation 30 may include “transaction information,” such as financialinformation (e.g., card numbers, account numbers, expiration datesetc.), individual-identifying information (e.g., name, address,signature, etc.), bank information, and/or transaction networkinformation, logos, designs, graphics, and/or other information. As willbe explained below, visible information 30 may be disposed on a surfaceof card 20 to enable information to be visible from first side 26 ofcard 20. In other embodiments, visible information 30 may also oralternatively be disposed on a surface of card 20 to enable informationto be visible from another side of card 20, such as second side 28.

Data storage component(s) 24 may also be visible, exposed, or otherwiseaccessible (e.g., visually, mechanically, or electronically) from firstside 26 of card 20. For example, data storage component(s) 24 (e.g., anEMV chip) may be accessible through an aperture 32 (shown in FIG. 2A),recess, or other type of opening on first side 26 of card 20. In someembodiments, data storage component(s) 24 and aperture 32 may be locatedon a different side of card 20, such as second side 28. In otherembodiments, first side 26 of card 20 may not include data storagecomponent(s) 24 or aperture 32.

As shown in FIG. 2B, visible information 34 may be disposed on and/orvisible from second side 28 of card 20. Visible information 34 mayinclude the same or different information with respect to visibleinformation 30 (referring to FIG. 2A). For example, visible information34 may include a signature, a code number, contact information, a serialnumber, a hologram, manufacturer information, and/or other information.

Data storage component(s) 36 (e.g., a magnetic strip) may be visiblefrom, disposed on, or otherwise accessible (e.g., visually,mechanically, or electronically) from second side 28 of card 20.Although data storage component(s) 36 is/are shown in FIG. 2B asextending along dimension D₂ (e.g., a length of card 20), it isunderstood that data storage component(s) 36 may extend along adifferent dimension (e.g., D₁) or multiple dimensions. In someembodiments, second side 28 of card 20 may not include data storagecomponent(s) 36. In other embodiments, data storage component(s) 36 maybe included on first side 26 of card 20.

FIG. 3 shows the card 20 of FIGS. 2A-2C with section line 4-4. FIG. 4Ashows a partially cut-away cross section of one embodiment of card 20taken along section line 4-4. As shown in the embodiment of FIG. 4A,card 20 may include a first card component 38 having an electricallyconductive surface 40 defining a first outer surface and an electricallyapplied coating 42 disposed on electrically conductive surface 40. Insome embodiments, first card component 38 may be formed of anelectrically conductive material that provides electrically conductivesurface 40.

For example, electrically conductive materials may include, but are notlimited to, metals (e.g., pure metals), metal alloys, metal-containingmaterials (i.e., materials that contain a metal or metal alloy and anon-metal material), and other materials capable of conductingelectricity sufficiently for purposes of receiving an electricallyapplied coating. Electrically applied coatings may include materials forcoating a surface that are applied to the surface by positively ornegatively charging the coating material and/or the surface to which thecoating material is applied.

Electrically conductive materials from which first card component 38 maybe formed include, but are not limited to, for example, aluminum,aluminum alloys, steel (e.g., carbon steel, steel alloys, stainlesssteel, etc.), copper, nickel, chromium, gold, silver, titanium,platinum, cadmium, tungsten, tin, lead, other metals, and/orcombinations thereof (e.g., alloys, layered combinations, etc.).Electrically conductive materials, such as those mentioned above and/orothers, may vary in terms of electrical properties (e.g., conductivity,resistivity, etc.), mechanical properties (e.g., rigidity, strength,hardness, elasticity, flexibility, toughness, density, etc.), cost, andappearance, among other factors. To achieve desired mechanicalproperties while ensuring card 20 complies with cost limitations and/ordimensional limitations or standards (e.g., ISO standards), the use ofcertain materials of desirable visual or tactile qualities to form firstcard component 38 may not be possible or feasible.

To enable greater variability in visual and tactile qualities of card 20while ensuring card 20 complies with mechanical, dimensional, and costrequirements, first card component 38 may be formed of an electricallyconductive material that satisfies the mechanical, dimensional, and costlimitations of card 20 while permitting a broad range of various surfacemodifications to be made for achieving desired visual and/or tactilequalities. For example, first card component 38 may be formed of amaterial that satisfies the dimensional and mechanical requirements ofcard 20, which is also electrically conductive for purposes receiving anelectrically applied coating. In this way, electrically conductivesurface 40 may be modified by the application of electrically appliedcoating 42 to achieve functional, visual and/or tactile qualities thatare different from the natural functional, visual or tactile qualitiesof electrically conductive surface 40. In this way, first card component38 at electrically conductive surface 40 may exhibit the functional,visual and/or tactile qualities of other materials, such as materialsthat are too expensive and/or are mechanically insufficient to complywith the dimensional or other mechanical requirements of card 20.

In other words, electrically conductive materials that are lessexpensive, more abundant, and which have more preferred mechanicalproperties than other materials can be used as a base which may bemodified on an exterior surface to present different properties, such asmore expensive, rarer, and less mechanically desirable materials (butwhich may have desirable visual or tactile properties). As will beexplained below, the use of less expensive and more abundant materialshaving desirable mechanical properties may allow for a standardizedprocess of manufacturing transaction cards with widely varying visualand tactile properties from a single type or narrow selection ofconstruction materials. Additionally, the manufacturing process can besimplified and streamlined, as it may be tailored to producing cardsfrom a single type or narrow selection of materials, thereby eliminatinga need to incorporate different or additional process steps foraccommodating the use of different or special materials.

As mentioned above, electrically conductive materials from which firstcard component 38 may be formed include, but are in no way limited to,for example, aluminum, aluminum alloys, steel (e.g., carbon steel, steelalloys, stainless steel, etc.), copper, nickel, chromium, gold, silver,titanium, platinum, cadmium, tungsten, tin, lead, other metals, and/orcombinations thereof (e.g., alloys, layered combinations, etc.). Forexample, in some non-limiting embodiments, first card component 38 maybe formed of, for example, steel, such as stainless steel. Under certainmarket conditions, stainless steel may be an economically advantageousmaterial from which to form first card component 38 due to itscomparatively lower cost, greater availability, heightened corrosionresistance, desirable mechanical properties, and suitability forreceiving an electrically applied coating, in comparison to othermaterials. Various grades of stainless steel may be used to form firstcard component 38. A non-limiting example of stainless steel that may beused to form first card component 38 is SUS-94 stainless steel.

In other non-limiting embodiments, aluminum alloys may be used to formfirst card component 38. Similar to stainless steel, aluminum alloys maybe economically advantageous under certain market conditions due totheir comparatively low cost, desirable mechanical properties, andsuitability for receiving electrically applied coatings, in comparisonto other materials. Several different types or grades of aluminum alloysmay be used to form first card component 38. Although stainless steeland aluminum alloys may be mentioned herein for purposes of discussionas exemplary materials from which first card component may be formed, itis to be understood that any of the above mentioned materials, or otherelectrically conductive materials consistent with this disclosure, maybe used.

Electrically applied coatings may include materials for coating asurface that are applied to the surface by positively or negativelycharging the coating material and/or the surface to which the coatingmaterial is applied. Electrically applied coatings may include, but arenot limited to, electroplated coatings, anodized coatings, powder coatedcoatings, electrostatically applied coatings, electrophoretic depositioncoatings (e.g., electrocoating, cathodic electrodeposition, anodicelectrodeposition, electrophoretic painting, etc.), and/or other typesof coatings. Thus, electrically applied coating 42 may be formed of anytype of coating material that can be applied using these or other typesof coating or material deposition processes. For example, electricallyapplied coating 42 may be formed of an applied metal or metal alloy, ametal oxide (e.g., anodic or cathodic layer), an electrostaticallyapplied material, such as a thermoplastic or thermoset polymer (e.g.,polyester, polyurethane, polyester-epoxy, fusion bonded epoxy, acrylics,etc.), and/or other materials. Other types of electrically appliedcoatings may be used.

In some embodiments, multiple sides of card 20 may be provided with anelectrically applied coating. For example, FIG. 4B shows a partiallycut-away cross section of another exemplary embodiment of card 20 takenalong section line 4-4 of FIG. 3. As shown in the example of FIG. 4B,first card component 38 of card 20 may have a first electricallyconductive surface 44 defining a first outer surface and a firstelectrically applied coating 46 disposed on first electricallyconductive surface 44. First card component 38 may also include a secondelectrically conductive surface 48 defining a second outer surface and asecond electrically applied coating 50 disposed on second electricallyconductive surface 48. As shown in FIG. 4, first card component 38 maybe formed of an electrically conductive material that provides first andsecond electrically conductive surfaces 44 and 48.

In some embodiments consistent with the example of FIG. 4B, first andsecond electrically applied coatings 46 and 50 may be the same type ofelectrically applied coating. That is, in some embodiments, first andsecond electrically applied coatings 46 and 50 may be formed of the samematerial using the same process. In other embodiments, first and secondelectrically applied coatings 46 and 50 may be different materialsand/or types of electrically applied coatings. That is, first and secondelectrically applied coatings 46 and 50 may be formed of differentmaterials and/or may be deposited using different application processes.In this way, one or more of the above-mentioned types of electricallyapplied coatings may be deposited onto card 20. As a result, variouscombinations of different electrically applied coatings providingdifferent levels of wear resistance, mechanical properties, electricalproperties, tactile responses, appearances, etc., can be achieved wheredesired on a single card.

For example, one side of card 20 may be coated with a shiny, lustrous,polished, glossy, or other type of smooth, slick, or relativelylower-friction surface, while another side of card 20 may be coated witha material providing a relatively higher-friction surface. In this way,desired visual or tactile qualities may be achieved on one side of card20, while another side of card 20 may be configured to resist slippingor sliding off of a surface our out of an enclosed space, such as fromwithin a wallet or card sleeve or pocket, or from between a user'shands, fingers, or gloves. As a result, instances of a card beingdropped, misplaced, lost, etc., may be avoided.

In some embodiments, card 20 may include multiple card components, eachhaving an electrically applied coating. FIG. 5 shows a front view ofcard 20 with section line 6-6. FIG. 6A shows a partially cut-away crosssection of an exemplary embodiment of card 20 taken along section line6-6 of FIG. 5. As shown in the example of FIG. 6A, card 20 may includefirst card component 38 and a second card component 52 attached to firstcard component 38. First and second card components 38 and 52 may bejoined by an adhesive layer 54. In other embodiments, first and secondcard components may be joined using a different mechanism, such aslamination, fasteners, snap-fit features, interconnecting features,and/or other types of joining techniques.

As shown in FIG. 6A, first card component 38 of card 20 may have a firstelectrically conductive surface 56 defining a first outer surface and afirst electrically applied coating 58 disposed on first electricallyconductive surface 56. First card component 38 may also have a firstinner surface 60 configured to be joined to second card component 52,for example via adhesive layer 54. Second card component 52 may includea second inner surface 62 and a second outer surface 64 opposite secondinner surface 62. Second inner surface 62 of second card component 52may be configured to be joined to first card component 38, for example,via adhesive layer 54. As shown in FIG. 6A, first card component 38 maybe formed of an electrically conductive material that provides firstelectrically conductive surface 56.

In the embodiment of FIG. 6A, first and second card components 38 and 52may be formed of the same or different materials. For example, firstcard component 38 may be formed of an electrically conductive material(such as those described above), and second card component 52 may beformed of an electrically conductive or electrically non-conductivematerial. In this way, a desired cost and overall mechanical performance(e.g., rigidity, elasticity, weight, density, strength, toughness, etc.)of card 20, which may not be achievable using only one type of materialor by selecting from a limited set of materials, may be achieved.

For example, in some embodiments, first card component 38 may beelectrically conductive and formed of a thin sheet (i.e., thinner thansecond card component 52) that is sufficient to enable the applicationof electrically applied coating 58 while reducing material costs. Secondcard component 52 may be thicker than first card component and formed ofa more cost effective material having mechanical properties that, whencombined with those of first card component 38, achieve desired overallmechanical properties of card 20. For example, second card component 52may be formed of a metal, metal alloy, injection molded or compressionmolded plastic, wood (i.e., natural wood) or wood-containing material(i.e., materials that contain natural wood and/or other non-woodcomponents), epoxy, fabric, rubber, ceramic, etc., but is not limitedthereto.

In other embodiments, first and second card components 38 and 52 mayeach include or be coated with an electrically applied coating. Forexample, as shown in FIG. 6B, first card component 38 may have a firstelectrically conductive surface 66 and a first electrically appliedcoating 68 disposed on first electrically conductive surface 66. Firstcard component 38 may also have a first inner surface 70 configured tobe joined to second card component 52, for example via adhesive layer54. Second card component 52 may have a second electrically conductivesurface 72 and a second electrically applied coating 74 disposed onsecond electrically conductive surface 72. Second card component 52 mayalso have a second inner surface 76 configured to be joined to firstcard component 52, for example via adhesive layer 54. As shown in FIG.6B, first card component 38 may be formed of an electrically conductivematerial that provides first electrically conductive surface 66, andsecond card component 52 may be formed of an electrically conductivematerial that provides second electrically conductive surface 72.

First and second card components 38 and 52 may be formed of the same ordifferent electrically conductive materials, such as the same one or acombination of different electrically conductive materials describedabove. Further, first and second electrically applied coatings 68 and 74may be the same or different types of electrically applied coatings,such as the same one or a combination of different coatings describedabove. The embodiment of FIG. 6B may enable first and second cardcomponents 38 and 52 to be prepared or manufactured separately, whichmay allow first and second card components to be more efficiently coatedusing different application processes. That is, while first cardcomponent 38 is being coated with first electrically applied coating 68using a first coating process, second card component 52 may be coatedwith second electrically applied coating 74 using a different process,which may require the use of different equipment or may take place at adifferent facility or different location within a facility. Thus,downtime and cost can be reduced by allowing both components to beformed separately and simultaneously. Once coated, first and second cardcomponents 38 and 54 can be joined to form card 20.

In some embodiments, card 20 may be formed of multiple componentsconfigured to encase, enclose, or at least partially contain certainother components of card 20. For example, as shown in FIG. 7 first cardcomponent 38 and second card component 52 may be separate componentsconfigured to at least partially contain one or more data storagecomponent(s) 78, such as a microchip 80, an NFC antenna 82, and/or amagnetic stripe 84 (e.g., magnetic stripe 82 may be configured tocommunicate or transmit data through first and/or second card component38, 52). First and second card components 38 and 52 may include a firstinner surface 86 and a second inner surface 88, respectively, configuredto at least partially define an interior cavity 90 that houses or atleast partially contains data storage component(s) 78. First cardcomponent 38 may also include a first outer surface 92 opposite firstinner surface 86, and second card component 52 may include a secondouter surface 94 opposite second inner surface 88. First card component38 may also include an aperture 96 configured to enable microchip 80 tobe engaged (e.g., mechanically, electrically, magnetically,electromagnetically, via radio frequency transmission, etc.). In otherembodiments, second card component 52 may also or alternatively includeaperture 96.

FIG. 8 shows a front view illustration of the embodiment of card 20 ofFIG. 7 having cross-section line 9-9. FIG. 9A shows a partially cut-awaycross section of an exemplary embodiment of card 20 taken along sectionline 9-9 of FIG. 8. As shown in the example of FIG. 9A, card 20 mayinclude first card component 38 and second card component 52 attached tofirst card component 38 (e.g., via a suitable joining mechanism, such asan adhesive, snap fit features, lamination, fasteners, interconnectingfeatures, and/or other types of joining techniques).

As shown in FIG. 9A, first card component 38 of card 20 may have a firstelectrically conductive surface 98 defining a first outer surface and afirst electrically applied coating 100 disposed on first electricallyconductive surface 98. First card component 38 may also have a firstinner surface 102 configured to be joined to second card component 52.Second card component 52 may include a second inner surface 104configured to be joined to first card component 38 and a second outersurface 106 opposite second inner surface 104.

As shown in FIG. 9A, first card component 38 may be formed of anelectrically conductive material (such as any of the electricallyconductive materials discussed above) that provides first electricallyconductive surface 98. First electrically conductive surface 98 may beconfigured to receive first electrically applied coating 100, which maybe any of the electrically applied coatings discussed above.

Second card component 52 may be formed of a material configured toenable data storage component(s) 78 to exchange, transmit, send,receive, or otherwise communicate data there through. That is, somematerials (e.g., certain metals) may inhibit or prevent datacommunication conducted via magnetic, electromagnetic, electric,radiofrequency, infrared, and/or other communication mechanisms, andsecond card component 52 may be formed of a material configured toenable or permit such communication. For example, second card component52 may be formed of non-metal materials, such as injection molded orcompression molded plastic, wood (i.e., natural wood) or wood-containingmaterial (i.e., materials that contain natural wood and/or othernon-wood components), epoxy, fabric, rubber, ceramic, etc., but is notlimited thereto. In this way, and in addition to enabling theachievement of tailored mechanical properties of card 20 (as similarlydiscussed above), the multi-component card construction of FIG. 9A maypermit desired visual and tactile qualities to be achieved via firstelectrically applied coating 100 while enabling data communicationbetween data storage component(s) 78 and other devices through secondcard component 52. Thus, data storage component(s) 78 may be protectedfrom wear and tear while desired mechanical, visual, and tactilecharacteristics may be achieved.

In other embodiments, as shown in FIG. 9B, second card component 52 maybe formed of an electrically conductive material (such as any of theelectrically conductive materials discussed above) that provides firstelectrically conductive surface 98. First electrically conductivesurface 98 may be configured to receive first electrically appliedcoating 100, which may be any of the electrically applied coatingsdiscussed above. Second card component 52 may also include a lip section108 that may optionally be coated with an electrically applied coating110 (shown in dashed lines), which may be the same or different thanfirst electrically applied coating 100. In some embodiments, the surface(or at least a portion of) lip section 108 may be raised above thesurface of first card component 38. In other embodiments, theapplication of electrically applied coating 110 to lip section may causelip section 108 to be raised above the surface of first card component38. In this way, the surface of first card component (which may includefirst electrically applied coating 100) may be protected from scratchingor other wear and tear when card 20 is used (i.e., swiped or insertedinto a card reader), dropped, slid across a surface (such as a counter,desk, or table), etc. In this way, lip section 108 and electricallyapplied coating 110, the material of which may be specifically selectedfor such protection purposes (e.g., as opposed to achieving otherdesired visual or tactile qualities), may enhance the service life ofcard 20.

Referring still to FIG. 9B, first card component 38 may be formed of amaterial configured to enable data storages component(s) 78 to exchange,transmit, send, receive, or otherwise communicate data there through.That is, first card component 38 may be formed of a material configuredto enable or permit such communication. For example, first cardcomponent 38 may be formed of non-metal materials, such as injectionmolded or compression molded plastic, wood (i.e., natural wood) orwood-containing material (i.e., materials that contain natural woodand/or other non-wood components), epoxy, fabric, rubber, ceramic, etc.,but is not limited thereto. In this way, and in addition to enabling theachievement of tailored mechanical properties of card 20 (as similarlydiscussed above), the multi-component card construction of FIG. 9B maypermit desired visual and tactile qualities to be achieved via firstelectrically applied coating 100 (and/or second electrically appliedcoating 110) while enabling data communication between data storagecomponent(s) 78 and other devices through first card component 38. Thus,data storage component(s) 78 may be protected from wear and tear whiledesired mechanical, visual, and tactile characteristics may be achieved.

In other embodiments, card 20 may only include data storage component(s)that are configured to communicate data through metal or otherelectrically conductive materials. In such embodiments and withreference to FIG. 9C, both first and second card components 38 and 52may be formed of electrically conductive materials, such as the samemetal or a combination of different metals (such as those discussedabove), which provide first electrically conductive surface 98 andsecond electrically conductive surface 112, respectively. Firstelectrically applied coating 100 and a second electrically appliedcoating 114 may be disposed on first and second electrically conductivesurfaces 98 and 112, respectively.

In some embodiments, card 20 may be formed of electricallynon-conductive components that are coated with electrically conductivematerials to provide an electrically conductive surface configured toreceive an electrically applied coating. For example, FIG. 10 shows afront view illustration of an exemplary embodiment of card 20 havingcross-section line 11-11. FIG. 11A shows a partially cut-away crosssection of an exemplary embodiment of card 20 taken along section line11-11 of FIG. 10. As shown in the example of FIG. 11A, card 20 mayinclude first card component 38. First card component 38 may be formedof an electrically non-conductive material or substrate, such as any ofthe electrically non-conductive materials discussed above. First cardcomponent 38 may include a first base surface 116 that may be coatedwith a first electrically conductive material 118.

First electrically conductive material 118 may be any electricallyconductive materials configured to receive an electrically appliedcoating, such as any of the electrically conductive materials describedabove. For example, in some embodiments, first electrically conductivematerial 118 may be a thin material, such as a metal sheet, a metalfoil, a layer of metal material applied using a dip coating, spray-oncoating, or another type of coating. In other embodiments, firstelectrically conductive material may be a metal plating, an electricallyconducive ink, electrically conductive paint (e.g., metallic paint),and/or another type of electrically conductive material. Firstelectrically conductive material 118 may be deposited on the entirety offirst base surface 116 or only a portion thereof—such as in shapes,patterns, or to form portions of visible information 30. Firstelectrically conductive material may adhere mechanically or chemicallyto first base surface 116. First electrically conductive material 118may provide a first electrically conductive surface 120, which defines afirst outer surface. In this way, electrically non-conductive materials,which may be cheaper or exhibit desirable mechanical properties, mayform at least a portion of card 20. This may allow the use of a broaderrange of materials while reducing the cost of card 20, without limitingthe range of visual and/or tactile properties that may be achieved byusing electrically applied coatings.

A first electrically applied coating 122 may be deposited on firstelectrically conductive surface 120 using any of the types of electricalapplication processes discussed above. To protect electrically appliedcoating 122 and/or to provide additional visual or tactile effects, acoating layer 124 may be optionally applied to electrically appliedcoating 122. Coating layer 124 may be an opaque, clear, transparent,translucent, or otherwise non-opaque coating. In some embodiments,coating layer 124 may be or comprise, for example, an acrylic, epoxy,urethane, polyurethane, sealant, paint, stain, or other type of coatingmaterial. In other embodiments, coating layer 124 may be an additional(e.g., a second) electrically applied material (i.e., in addition toelectrically applied coating). For example, when electrically appliedcoating 122 comprises a conductive material, coating layer 124 may be orcomprise an electrically applied material (e.g., an electrically appliedcoating), such as any of the electrically applied coatings discussedabove. Although coating layer 124 is shown in the example of FIG. 11A,it is noted that coating layer may be applied to any embodimentdisclosed herein. It is also noted that in some embodiments, coatinglayer 122 may be applied to multiple sides of card 20, whether or notsuch side(s) are first coated with an electrically applied coating.

FIG. 11B shows the example of FIG. 11A wherein a second base surface 126of first card component 38 is coated in the same way as first basesurface 116. That is, second base surface 126 may be coated with asecond electrically conductive material 128, which may be the same as ordifferent from first electrically conductive material 118. Successivelayers are possible, as long as the outer surface is conductive or anyinterposed layers do not preclude deposition on the successive layer.Second electrically conductive material 128 may be deposited on theentirety of second base surface 126 or only a portion thereof—such as inshapes, patterns, or to form portions of visible information 34(referring to FIG. 2B). Second electrically conductive material 128 mayprovide a second electrically conductive surface 130 configured toreceive a second electrically applied coating 132. In this way, one ormore of the above-mentioned types of electrically applied coatings maybe deposited onto card 20; one onto first electrically conductivesurface 120, and another on second electrically conductive surface 130.As a result, various combinations of different electrically appliedcoatings providing different levels of wear resistance, mechanicalproperties, electrical properties, tactile responses, appearances, etc.,can be achieved on a single card.

FIG. 11C shows the example of FIG. 11A, further including second cardcomponent 52 connected to first card component via adhesive layer 54. Asshown, the embodiment of FIG. 11C, an outward-facing surface of secondcard component 52 may form second base surface 126. Second base surface126 may be coated with a second electrically conductive material 128defining a second outer surface. Second electrically conductive material128 may be the same as or different than first electrically conductivematerial 118. In this way, second electrically conductive material 128may provide a second electrically conductive surface 130 configured toreceive a second electrically applied coating 132. Second electricallyapplied coating 132 may be the same or different than first electricallyapplied coating 122.

The embodiment of FIG. 11C may enable first and second card components38 and 52 to be prepared or manufactured separately, which may allowfirst and second card components 38 and 52 to be more efficiently coatedusing different application processes. That is, while first cardcomponent 38 is being coated with first electrically conductive material118 and first electrically applied coating 122 using a first set ofcoating processes, second card component 52 may be coated with secondelectrically conductive material 128 and second electrically appliedcoating 132 using a different set of coating processes, which mayrequire the use of different equipment or may take place at a differentfacility or different location within a facility. Thus, downtime andcost can be reduced by allowing both components 38 and 52 to be formedseparately and simultaneously. Once coated, first and second cardcomponents 38 and 52 can be joined to form card 20.

In some embodiments, one or more outer surfaces of card 20 may bepost-processed to achieve desired visual or tactile properties. Forexample, outer surfaces of card 20 may be etched, engraved, scored,inscribed, or otherwise mechanically or chemically processed after beingformed. Outer surfaces of card 20 may include, for example, electricallyconductive surface 40, 44, 48, 56, 66, 72, 98, 112, 120, and 130. Insome embodiments, outer surfaces of card 20 may also include surfaces ofelectrically applied coating 42, 46, 50, 58, 68, 74, 100, 114, 122, 132.In other embodiments, outer surfaces of card 20 may include surfaces offirst card component 38 and/or second card component 58.

Post-processing of outer surfaces of card 20 may include machining,processes, chemical processes, and or other processes. For example,post-processing may include die casting, milling, stamping, sanding,sandblasting, scoring, buffing, polishing, hammering, knurling,brushing, perforating, mechanical etching or inscribing, chemicaletching, etc. Post-processing may be conducted using manually operatedequipment or computer operated equipment, such as computer numericalcontrol (CNC) machines. Post-processing may be performed on any of theouter surfaces mentioned above, after their respective formation.

Several advantages of the present disclosure may be realized through theimplementation of its embodiments. By forming card components ofelectrically conductive material, less expensive materials having moredesirable mechanical properties may be used, thereby lowering the costto manufacture card 20. Further, the ability of the selected material toreceive various types of electrically applied coatings may allow asingle type of material (or a limited selection of materials) thatsatisfy the mechanical and cost requirements of card 20 to be used informing cards with widely varying visual and tactile properties. Thismay greatly simplify the process of manufacturing card 20 by reducingthe number of different types of machines and tools for handlingdifferent materials, reduces the complexity of the raw material supplychain, allows for more predictable and consistent quality, and ensuresapplicable standards can be met by all types of cards produced. As aresult, higher quality cards may be produced at a lower cost withgreater variability in visual and tactile qualities.

1. A transaction card, comprising: a first card component defining afirst side of the transaction card and having an electrically conductivesurface configured to receive an electrically applied coating; anelectrically applied coating formed on the electrically conductivesurface of the first card component; a second card component joined tothe first card component by a snap fit feature, the second cardcomponent defining a second side of the transaction card, wherein thefirst and second card components are configured to define an interiorcavity; and a data storage component disposed within the interiorcavity, wherein at least one of the first or second card component isconfigured to enable communication between the data storage componentand another device.
 2. The transaction card of claim 1, wherein: thedata storage component comprises an EMV chip; and the transaction cardfurther comprises an aperture configured to enable communication betweenthe EMV chip and an associated device.
 3. The transaction card of claim1, wherein the data storage component comprises a magnetic strip joinedto the second card component.
 4. (canceled)
 5. The transaction card ofclaim 4, wherein the second card component is configured to enable thedata storage component to communicate with an associated device externalto the transaction card.
 6. The transaction card of claim 1, wherein thefirst card component comprises metal, and the second card componentcomprises plastic.
 7. The transaction card of claim 1, wherein: thefirst card component comprises an electrically conductive materialapplied to a substrate, and wherein the electrically conductive materialapplied to the substrate comprises one of a metal plating, anelectrically conductive foil, a printed conductive ink, or anelectrically conducive paint
 8. The transaction card of claim 7, whereinthe substrate comprises at least one of a metal or a plastic.
 9. Thetransaction card of claim 1, wherein the electrically applied coatingcomprises at least one of an electrostatically applied coating, anelectrophoretic deposition coating, an electroplated coating, ananodized coating, or a powder coated layer.
 10. The transaction card ofclaim 1, further comprising a coating layer disposed on the electricallyapplied coating, and wherein the coating layer comprises a non-opaqueelectrically applied material.
 11. A method of manufacturing atransaction card, the method comprising: forming a first card componentdefining a first side of the transaction card and having an electricallyconductive surface configured to receive an electrically appliedcoating; forming an electrically applied coating on the electricallyconductive surface of the first card component; forming a second cardcomponent defining a second side of the transaction card; joining thesecond card component to the first card component by a snap fit feature,wherein the first and second card components are configured to define aninterior cavity; and disposing a data storage component within theinterior cavity; wherein at least one of the first or second cardcomponent is configured to enable communication between the data storagecomponent and another device.
 12. The method of claim 11, wherein: thedata storage component comprises an EMV chip; and the transaction cardfurther comprises an aperture configured to enable communication betweenthe EMV chip and an associated device.
 13. The method of claim 11,wherein the data storage component comprises a magnetic strip joined tothe second card component.
 14. (canceled)
 15. The method of claim 14,wherein the second card component is configured to enable the datastorage component to communicate with an associated device external tothe transaction card.
 16. The method of claim 11, wherein the first cardcomponent comprises metal, and the second card component comprisesplastic.
 17. The method of claim 11, wherein: forming the first cardcomponent comprises applying an electrically conductive material to asubstrate, and wherein the electrically conductive material applied tothe substrate comprises one of a metal plating, an electricallyconductive foil, a printed conductive ink, or an electrically conducivepaint
 18. The method of claim 17, wherein the substrate comprises atleast one of a metal or a plastic.
 19. The method of claim 11, whereinthe electrically applied coating comprises at least one of anelectrostatically applied coating, an electrophoretic depositioncoating, an electroplated coating, an anodized coating, or a powdercoated layer.
 20. The method of claim 11, further comprising disposing acoating layer on the electrically applied coating, wherein the coatinglayer comprises a non-opaque electrically applied material.